Systems configured for utilizing two or more of multiple different semiconductor component configurations, methods of providing semiconductor components within sockets, and methods of retaining semiconductor component configurations within sockets

ABSTRACT

The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.

TECHNICAL FIELD

The invention pertains to systems configured for utilizing two or moreof multiple different semiconductor component configurations, to methodsof providing semiconductor components within sockets, and to methods ofretaining semiconductor component configurations within sockets.

BACKGROUND OF THE INVENTION

Semiconductor components, such as dice and packages, are frequentlyprovided in sockets for incorporation into electrical systems, and/orfor testing. For instance, the sockets can be configured to be attachedto circuit boards so that circuitry associated with the semiconductorcomponents can be electrically connected through the sockets tocircuitry associated with the boards.

Exemplary prior art sockets are described with reference to FIGS. 1-12;with FIGS. 1-8 illustrating one type of socket, and FIGS. 9-12illustrating another type of socket.

Referring to FIGS. 1-4, a prior art socket 10 is illustrated. The socketis shown in FIGS. 1 and 2 with a retaining mechanism in a retainingposition (discussed below); and in FIGS. 3 and 4 with the retainingmechanism in a non-retaining position (also discussed below).

The socket 10 includes a base 16 (FIGS. 2 and 3), and a movable lid 18joined to the base. The base 16 includes mounting pins 22 configured formounting the socket to a board or other suitable substrate having matingopenings configured for engaging the mounting pins 22. Base 16 furtherincludes pin contacts 24 configured to engage mating contacts on theboard or other substrate to which the socket is to be mounted, and toprovide electrical coupling between a semiconductor component retainedin the socket with other circuitry external of the socket. Base 16 alsoincludes a contact plate 26 having a plurality of openings 28 (only someof which are labeled) extending therethrough. The openings areconfigured to align with terminal contacts of a semiconductor componentretained in the socket, and electrical interconnects (not shown) areprovided in the base to extend through the openings and electricallycouple the terminal contacts of the semiconductor component with thecontacts 24 of the socket.

Lid 18 has an opening 19 therein within which a semiconductor componentis placed to ultimately rest on the contact plate 26 of the base.

Lid 18 is movably mounted to base 16 and operates a retention mechanismcontaining a pair of clamps 32 configured to retain a semiconductorcomponent in contact plate 26. The clamps ultimately compress asemiconductor component against plate 26. The retention mechanism has aretaining position (FIGS. 1 and 2) and a non-retaining position (FIGS. 3and 4). The retaining position retains a semiconductor component againstplate 26, and the non-retaining position exposes the plate so that asemiconductor component can be placed against the plate. Thenon-retaining position can be considered a loading position, in thatsuch position enables a semiconductor component to be loaded into thesocket; and the retaining position can be considered a latched position.

Springs 34 (FIG. 2) bias the lid 18 and the clamps 32 of the retentionmechanism to the latched position of FIGS. 1 and 2. Compression of lid18 toward base 16 retracts the clamps 32 into the loading position ofFIGS. 3 and 4.

Movement of lid 18 relative to base 16 thus shifts the retainingmechanism between a retaining position and a non-retaining position. Themovement of lid 18 relative to base 16 is illustrated in FIGS. 2 and 3by axes 35. Although not shown, the movement of lid 18 relative to base16 can also shift the location of contact plate 26 so that electricalinterconnects (not shown) beneath the plate extend upwardly through theopenings 28 to contact terminal contacts of a semiconductor componentwhen the clamps 32 are in the latched position.

The sockets of FIGS. 1-4 are standard sockets which have not beenmodified to retain particular semiconductor components. The sockets canbe modified by attaching nests within openings 19 to provide lateralalignment for semiconductor components placed within the openings. FIG.5 shows a side view of the socket 10 of FIG. 4 at the loading positionof FIG. 4, and together with a nest 20 and semiconductor component 12which are to be provided within the opening 19 of the lid. The nest 20comprises a pair of retaining prongs 40 configured to extend withinmating openings 42 (shown in FIG. 4) of socket 10 so that the nest canbe clipped into the socket. The semiconductor component comprises aplurality of terminal contacts (not shown), which can, for example,protrude from the package as solder bumps or balls (and thus can be aBall Grid Array, BGA), or can be non-protruding (typically planar)conductive surfaces (and thus can be, for example, a Land Grid Array,LGA; Leadless Chip Carrier, LCC; Quad Flat-Pack No-Lead Package, QFN;Micro Lead Frame, MLF; etc.).

FIG. 6 shows a top view of the nest 20, and also shows a top view of thesemiconductor component 12 which will be aligned with the nest. The nesthas an outer peripheral outline 21 matching an outline of the hollowinterior region 19 of the socket lid, and has an inner peripheraloutline 23 matching an outer peripheral outline 13 of semiconductorcomponent 12. The inner peripheral outline 23 has a sloped alignmentsurface 25 for aligning component 12 as it is inserted into the nest.

FIG. 7 shows socket 10 after the nest 20 is inserted into opening 19 andclipped into place; and shows clamps 32 in the loading position.

FIG. 8 shows socket 10 after semiconductor component 12 is insertedwithin nest 20, and after clamps 32 have been shifted into the retainingposition.

The socket 10 of FIGS. 1-8 is one example of a prior art socket. Suchutilizes a retention mechanism which clamps a semiconductor componentagainst the bottom (base) portion of the socket. FIGS. 9-12 illustrateanother prior art socket 50 which utilizes a different type of retentionmechanism. The socket 50 is configured to be utilized with semiconductorcomponents having terminal contacts which extend outwardly from thecomponents. An example of such semiconductor component is shown in FIG.9 as a component 52, with the illustrated component having terminalcontacts 54 extending outwardly from a shown bottom surface of thecomponent. The terminal contacts can, for example, correspond to solderballs of a BGA.

Socket 50 comprises a base 56 and movable lid 58, similar to the baseand movable in of the above-described socket 10. The base comprises acontact plate 62 having a plurality of openings 64 (only some which arelabeled) extending therethrough.

Lid 58 is compressibly mounted to the base through springs 60. Inoperation, compression of the lid opens a retaining mechanism comprisingclamps configured to grasp the projecting terminal contacts 54. Theclamps are beneath or within the openings 64 as described in more detailwith reference to FIGS. 11 and 12. Specifically, FIG. 11 shows anexpanded view of a portion of plate 62 containing several of theopenings 64. The openings have clamps 66 therein. In the view of FIG.11, the clamps are in an open, or non-retaining, position. FIG. 12 showsthe expanded region of FIG. 11 with the clamps 66 in a closed, orretaining, position.

Socket 50 illustrates an alternative type of retaining mechanism to thatof the socket 10 of FIGS. 1-8. The prior art also includes sockets whichutilize combinations of retention mechanisms analogous to that of FIGS.1-8 with mechanisms analogous to that of FIGS. 9-12.

Nests similar to the nests discussed above with reference to FIGS. 1-8can be utilized with sockets 50 for aligning components 52 within thesockets. Accordingly, the prior art nests can be utilized with any ofnumerous different socket designs.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagrammatic top view of a prior art socket with a retentionmechanism in a retaining position.

FIG. 2 is a side view of the prior art socket of FIG. 1, with theretention mechanism being in the retaining position.

FIG. 3 is a side view of the prior art socket of FIG. 1, with theretention mechanism being in a non-retaining position.

FIG. 4 is a top view of the prior art socket of FIG. 1, with theretention mechanism being in the non-retaining position.

FIG. 5 is a side view of the prior art socket of FIG. 4, together with aprior art nest and semiconductor component which ultimately form anassembly with the socket.

FIG. 6 shows top views of the component and nest of FIG. 5.

FIG. 7 is a top view of a prior art assembly comprising the nest of FIG.6 retained within the socket of FIG. 4.

FIG. 8 is a top view of the prior art assembly of FIG. 7 after thesemiconductor component of FIG. 6 is inserted within the nest, and theretention mechanism is shifted to the retaining position.

FIG. 9 is a side view of a socket in accordance with another aspect ofthe prior art, together with a side view of a component suitable forbeing retained within the socket.

FIG. 10 is a top view of the prior art socket of FIG. 9.

FIG. 11 is an expanded view of a region of the prior art socket of FIG.10 showing a retention mechanism in a non-retaining position.

FIG. 12 shows the expanded region of FIG. 11 with the prior artretention mechanism in a retaining position.

FIG. 13 illustrates a socket and several items of an assembly configuredin accordance with an aspect of the present invention for providing asemiconductor component into the socket.

FIG. 14 illustrates the socket and assembly of FIG. 13 at a processingstage subsequent to that of FIG. 13.

FIG. 15 illustrates the socket and assembly of FIG. 13 at a processingstage subsequent to that of FIG. 14.

FIG. 16 illustrates the socket and assembly of FIG. 13 at a processingstage subsequent to that of FIG. 15.

FIG. 17 illustrates the socket and assembly of FIG. 13 at a processingstage subsequent to that of FIG. 16.

FIG. 18 illustrates the socket and assembly of FIG. 13 at a processingstage subsequent to that of FIG. 17.

FIG. 19 illustrates the socket and assembly of FIG. 13 at a processingstage subsequent to that of FIG. 18. The socket and a removable nest ofthe assembly are shown in partial cut-away view in FIG. 19 to assist thereader in understanding the invention.

FIG. 20 illustrates the socket and assembly of FIG. 13 at a processingstage subsequent to that of FIG. 19. The socket and removable nest ofthe assembly are shown in partial cut-away view in FIG. 20 to assist thereader in understanding the invention.

FIG. 21 illustrates the socket and assembly of FIG. 13 at a processingstage subsequent to that of FIG. 20. The socket is shown in partialcut-away view in FIG. 21 to assist the reader in understanding theinvention.

FIG. 22 illustrates the socket and assembly of FIG. 13 at a processingstage subsequent to that of FIG. 21. The socket is shown in partialcut-away view in FIG. 22 to assist the reader in understanding theinvention.

FIG. 23 is a diagrammatic top view of a socket at a preliminaryprocessing stage in accordance with another aspect of the presentinvention.

FIG. 24 is a diagrammatic top view of an assembly comprising the socketof FIG. 23 at a processing stage subsequent to that of FIG. 23.

FIG. 25 is a diagrammatic top view of an assembly comprising the socketof FIG. 23 at a processing stage subsequent to that of FIG. 24.

FIG. 26 is a diagrammatic top view of an assembly comprising the socketof FIG. 23 at a processing stage subsequent to that of FIG. 25.

FIG. 27 illustrates the socket of FIG. 13 with a different assembly fromthat of FIGS. 13-22, and at a processing stage analogous to that of FIG.15.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

This disclosure of the invention is submitted in furtherance of theconstitutional purposes of the U.S. Patent Laws “to promote the progressof science and useful arts” (Article 1, Section 8).

As used herein, the term “semiconductor component” refers to anelectronic element that includes a semiconductor die. Exemplarysemiconductor components include semiconductor packages, semiconductordice, BGA devices, LGA devices, LCC devices, QFN devices, MLF devices,and direct digital control (DDC) devices.

Semiconductor components can have any of numerous geometricalconfigurations. Such geometrical differences can be differences in size(footprint), or differences in geometrical shape. For instance, as theindustry advances, semiconductor manufacturers are developing newcomponents having smaller peripheral outlines (footprints), and denserconfigurations of terminal contacts. As a specific example, a secondgeneration component, such as a chip scale package (CSP), typically hasa smaller outline than a first generation component, such as a ball gridarray (BGA) device.

The differences in geometrical configuration amongst various componentscan render it difficult to utilize the components within existingsockets. Sockets are generally configured in standard sizes, andaccordingly utilization of various geometrically different componentswithin the sockets entails modification of the sockets. Suchmodification will frequently comprise insertion of nests within thesockets, with the nests being tailored to align particular components.The sockets modified by having the nests incorporated therein are nolonger generally suitable for utilization of a large number of differentcomponents, but rather have become specifically tailored for utilizationwith a small subset of components. Thus, a company utilizing a largenumber of different components, or a person in the field working with avariety of different components, will stock a variety of differentmodified sockets suitable for utilization with the different components.It would be desired to develop technologies whereby the sockets are notsubstantially modified so that the standard sockets remain generallyapplicable for utilization with a variety of different components toavoid problems associated with stocking a variety of modified sockets.

The invention includes aspects in which removable mechanical precisingmechanisms (such as removable nests), and/or optical-based precisingmechanisms, are utilized to align semiconductor components withinsockets so that generic socket configurations can be utilized withvarious semiconductor configurations. Specific aspects of the inventionare described with reference to FIGS. 13-27.

Referring initially to FIG. 13, such diagrammatically illustrates anapparatus 70 comprising a controller 72 linked to a socket 74, aremovable nest 76, a manipulator 78, and a tray 80. The tray 80 containsa plurality of semiconductor components 82. The apparatus will beutilized for loading at least one of semiconductor components into thesocket, as will become more clear from the discussion that follows.

The manipulator 78 can be any device which can pick a semiconductorcomponent 82 from tray 80 and transfer it to the socket 74. In someaspects, the manipulator can be a vacuum wand.

The socket 74 can be a socket of the types described previously in the“background” section of this disclosure. Accordingly, the socket canhave a base 71, a lid 73 on the base, and a retention mechanismcontaining clamps 75. The retention mechanism is associated with thebase and configured to retain semiconductor components within thesocket. The lid 73 can be movable relative to the base, with suchmovement shifting the retention mechanism between a retaining positionand a non-retaining position. Although the lid 73 is shown having aconfiguration similar to the socket lids of the prior art devicesdiscussed in the “background” section of this disclosure, it is to beunderstood that the lid can have other configurations. For instance, insome aspects (discussed below) the lid is a mechanism of a socket whichengages a removable nest to shift a retaining mechanism between aretaining position and a non-retaining position, and the lid has littleto do with aligning semiconductor components within the socket. Insteadthe removable nest, and/or an optical system is utilized for thealigning of the semiconductor components. In such aspects, the lid canbe of any configuration suitable to engage at least a portion of theremovable nest, and may, for example, be only one or more posts and/orridges configured to engage the removable nest.

The semiconductor components 82 have exposed upper surfaces 81 which canbe engaged by manipulator 78. The semiconductor components will havebottom surfaces (not visible in FIG. 13) in opposing relation to theupper surfaces 81, and such bottom surfaces will have terminal contactssimilar to the terminal contacts discussed in the “background” sectionof this disclosure. Such terminal contacts can, for example, correspondto the non-protruding (typically planar) contacts of an LGA, LCC, QFN,or MLF; or to solder bumps or solder balls of a BGA. The semiconductorcomponents 82 have lateral peripheries comprising sidewall edges 83(only some of which are labeled).

The nest 76 is configured to fit within the lid 73 of the socket. Thenest can be utilized to compress the lid toward the base 71 of thesocket, and to thereby shift the retention mechanism into thenon-retaining (loading) position. The nest has an inner periphery 77configured to align a semiconductor component. In the shown aspect, thealigning inner periphery of the nest is configured to surround an entirelateral periphery of a component, but it is to be understood that thenest can also configured such that the aligning inner peripherysurrounds only a portion of a semiconductor component.

Nest 76 can be formed of any suitable material, and in typical aspectswill be formed of a low-cost, easily moldable or machinable material,such as, for example, plastic or aluminum.

Nest 76 is an example of an alignment tool for aligning a semiconductorcomponent within the lid of a socket, and specifically is an example ofa mechanical tool, or mechanical precising system, which can be utilizedin some aspects of the present invention: With the term “mechanicalprecising system” referring to a system which mechanically aligns asemiconductor component within a socket.

Controller 72 can be any apparatus suitable for controlling theorientation of the manipulator 78, removable nest 76, socket 74 andsemiconductor component tray 80 relative to one another. In someaspects, controller 72 can be replaced with two or more separatecontrollers.

Referring to FIGS. 14-16, manipulator 78 is utilized to pick asemiconductor component 82 from tray 80 and transfer the component toproximate nest 76.

Referring next to FIGS. 17 and 18, nest 76 is provided within lid 73 ofsocket 74 and then utilized to compress the lid toward the base 71. Thecompression can be accomplished by pressing nest 76 toward the baseand/or pressing the base toward the nest. The compression of the lidtoward the base shifts the clamps 75 of the retention mechanism into aloading position as discussed above with reference to prior art FIGS.1-4.

Referring to FIG. 19, manipulator 78 is utilized to move thesemiconductor component 82 into the socket 74 while the alignment tool76 compresses the lid 73 to keep the clamps 75 of the retentionmechanism in the loading position. The alignment tool 76 and socket 74are shown in partial cut-away view in FIG. 19 so that the clamps 75 canbe seen to be in the loading position.

The alignment tool 76 is utilized for aligning the semiconductorcomponent 82 within the socket (which can also be referred to asdetermining alignment of the component within the socket). Specifically,the inner periphery 77 of the alignment tool is configured to align thesemiconductor component in a desired orientation within the socket. Theinner periphery of the alignment tool can be configured to have tighttolerances to a desired alignment so that the alignment is accomplishedentirely by mechanical alignment of the lateral periphery of thesemiconductor component to the inner periphery of the alignment tool. Inother aspects, the alignment tool can have looser tolerances and can beutilized to coarsely align the semiconductor component within thesocket, and the fine alignment can be encompassed with another alignmenttool. For instance, the fine alignment can be accomplished with anoptical alignment tool which is coupled with controller 72 and utilizedto orient the manipulator 78 within the socket.

An optical alignment tool 90 is shown in dashed-line view in FIG. 19 toindicate that the optical alignment tool can be utilized optionally incombination with the mechanical alignment tool 76. If an opticalalignment tool is utilized, there can be some markings provided on thesemiconductor component which can be optically located by the opticalalignment tool, and/or the tool can be configured to recognizecharacteristics associated with the outline/profile of the component,and/or the tool can be configured to recognize characteristicsassociated with protruding features of some packages (e.g., theprotruding balls of a BGA). The tool 90 is shown having radiation 91projected therefrom, which is the electromagnetic radiation that theoptical alignment tool utilizes for ascertaining alignment of thesemiconductor component within the socket. Any suitable electromagneticradiation can be utilized, including, but not limited to, light in thevisible range.

In some aspects of the invention, the nest 76 is utilized only forcompression of the lid, and all of the alignment of the semiconductorcomponent within the socket is accomplished utilizing an opticalalignment tool. The optical alignment tool can be of particular benefitwhen utilizing semiconductor components having lateral peripheries whichare difficult to geometrically align, such as, for example, whenutilizing circular semiconductor components or other shapes ofsemiconductor components having one or more axes of symmetry.

Once the semiconductor component is appropriately aligned within thesocket, the manipulator 78 is utilized to compress the component againstthe base of the socket to retain the component in a desired orientation.Subsequently, the nest 76 is withdrawn from within the socket whichallows biasing mechanisms within the socket to push the lid 73 away fromthe base 71 and thereby begin shifting clamps 75 to a retainingposition, as shown in FIG. 20. The alignment tool 76 and socket 74 areshown in partial cut-away view in FIG. 20 so that the clamps of theretention mechanism can be seen shifting to the retaining position.

The processing of FIGS. 19 and 20 is a significant departure from priorart processes for aligning components within sockets. Specifically,prior art processes would utilize a nest clipped within the socket toalign a semiconductor component within the socket, and would utilize adevice separate from the nest for compressing the socket and therebyshifting the retaining mechanism to the loading position. The prior artprocesses would further typically not use the manipulator to carry thecomponent all the way to the base of the socket, but would rather placethe retention mechanism in the loading position and then drop thesemiconductor component from the manipulator while the component is inclose proximity to a final seating location of the socket. The prior artprocesses would thus allow the component to seat itself within thesocket under its own weight, while utilizing the interior periphery ofthe nest, and possibly guiding features associated with the terminalcontacts of the semiconductor component (for instance, solder balls of aball grid array) to align the semiconductor component. In contrast, thepresent invention maintains controlled placement of the semiconductorcomponent within the socket by maintaining contact of the component tothe manipulator until the retention mechanism is fully shifted to aretaining position; and thus until the retaining mechanism is tightlyclamping the semiconductor component to the base of the socket.

Referring to FIG. 21, mechanical alignment tool 76 is further withdrawnfrom within socket 74, and manipulator 78 remains in contact withsemiconductor component 82 to retain the component in a desiredorientation until the clamps 75 of the retention mechanism have fullyshifted to the retaining position. The socket is shown in partialcut-away view in FIG. 21 so that the clamps can be seen to be in theretaining position.

Referring to FIG. 22, the component 82 within socket 74 is released frommanipulator 78 after the clamps 75 of the retention mechanism are fullyin the retaining position. The socket is shown in partial cut-away viewin FIG. 22 so that the clamps can be seen to be in the retainingposition.

The processing of FIGS. 13-22 can be repeated for multiple sockets byindexing a new socket into orientation to have a semiconductor componentprovided therein, and/or indexing any or all of the nest 76, manipulator78, optical alignment device 90 and tray 80 to a new location to providea semiconductor component within another socket. Various of the shownsteps of FIGS. 13-22 can be changed in order in various aspects of theinvention. For instance, the compression of the socket can be conductedprior to picking a component from the tray.

Although the processing of FIGS. 13-22 shows a single semiconductorcomponent being transferred from the tray to a single socket with asingle manipulator and single alignment tool; it is to be understoodthat the invention can also include aspects in which multiplemanipulators are ganged together, and/or in which multiple alignmenttools are ganged together, so that multiple semiconductor components canbe transferred to multiple sockets in batch; and/or so that multiplecomponents can be transferred to a single socket.

The exemplary processing of FIGS. 13-22 utilizes a socket having aretention mechanism of the type described relative to prior art FIGS.1-8. Specifically, the retention mechanism comprises clamps configuredto compress a semiconductor component against the base (or bottom) of asocket. Such methodology can be utilized with semiconductor componentscomprising terminal contacts arranged as a land grid array, ball gridarray, or other configurations. It is to be understood, however, thataspects of the present invention can be utilized with numerous othersocket retention mechanisms, including, for example, the retentionmechanism described above with reference to prior art FIGS. 9-12. Thus,a semiconductor component utilized with methodology of the presentinvention can comprise a plurality of terminal contacts arranged in aball grid array, and the socket utilized with methodology the presentinvention can include a retention mechanism which comprises clampsconfigured to grasp individual balls of the ball grid array. In someaspects, a semiconductor component can comprise a plurality of terminalcontacts arranged in a ball grid array, and the socket can utilize aretention mechanism which comprises clamps to grasp individual balls ofthe ball grid array, and which also comprises clamps configured tocompress the component against the base of the socket.

Although aspects of the invention can be utilized with semiconductorcomponents having protruding terminal contacts (such as BGAs), theinvention can be particularly useful when utilized with semiconductorcomponents lacking protruding contacts (such as LGAs, LCCs, QFNs, andMLFs). When semiconductor components lack protruding terminal contacts,there is very little to use for fine alignment of the components withina socket except for peripheral features, and/or optical alignmentfeatures provided in addition to the peripheral features. The presentinvention can utilize mechanical precising tools and/or opticalprecising tools tailored to peripheral and/or optical alignment featuresof the semiconductor components, and yet only transiently associatedwith sockets during alignment of the components so that the sockets arenot permanently modified to engage particular semiconductor components.

The aspect of the invention discussed with reference to FIGS. 13-22provided a single semiconductor component within a socket. However, asindicated above, the invention can also include aspects in whichmultiple discrete semiconductor components are provided within a singlesocket. FIGS. 23-26 illustrate an exemplary aspect in which multiplesemiconductor components are provided within a single socket.

Referring to FIG. 23, a socket 100 is illustrated in top view. Thesocket can be similar to the socket 74 discussed above with reference toFIGS. 13-22. However, the socket 100 comprises four clamps 102, incontrast to the socket 74 which comprises only two clamps 75. The fourclamps 102 can be subdivided into two pairs which each correspond toseparate retention mechanisms. For instance, the leftmost pair of clampsof FIG. 23 can be considered to correspond to a first retentionmechanism 104, and the rightmost pair of clamps can be considered tocorrespond to a second retention mechanism 106. Both of the retentionmechanisms are shown in a retaining position, and specifically theclamps are shown extending over a perforated region 108 of a base of thesocket.

Referring to FIG. 24, a pair of removable, mechanical alignment tools114 and 116 are provided within socket 100 and utilized to compress alid of the socket to shift retention mechanisms 104 and 106 intonon-retaining positions. The mechanical alignment tools 114 and 116 canbe referred to as a first alignment tool and a second alignment tool,respectively. The first and second alignment tools can be separate fromone another, as shown, or can be together integrated into a one-piecetool.

FIG. 24 shows an optional optical alignment tool 118 which can beutilized in combination with the mechanical alignment tools 114 and 116for aligning semiconductor components, analogously to the alignmentdiscussed above with reference to FIG. 19. Dashed line arrows 119extending from optical alignment tool 118 diagrammatically representelectromagnetic radiation projected from the tool and utilized foroptical alignment of semiconductor components.

Referring next to FIG. 25, semiconductor components 120 and 122 areplaced within mechanical alignment tools 114 and 116, respectively; andare retained in position within the socket by manipulators 124 and 126,respectively. The manipulators can be referred to as a first manipulator124 and a second manipulator 126, and can be analogous to themanipulator 78 discussed above with reference to FIGS. 13-22. Althoughthe semiconductor components 121 and 122 are shown being identical toone another, it is to be understood that the components could differfrom one another in geometrical configuration, and in such aspects themechanical alignment tools 114 and 116 could also geometrically differfrom one another, and further the retention mechanisms 104 and 106 couldgeometrically differ from one another. Also, although two manipulatorsare shown, it is to be understood that a single multi-prongedmanipulator could be utilized to simultaneously place both of components120 and 122 within the socket.

The optical alignment tool 118 and mechanical alignment tools 114 and116 can be together utilized to align components 120 and 122 in desiredorientations within socket 100.

Referring to FIG. 26, the mechanical alignment tools 114 and 116 arewithdrawn from the socket, shifting retention mechanisms 104 and 106into retaining positions; and subsequently manipulators 124 and 126(FIG. 25) are detached from semiconductor components 120 and 122.

In some aspects, the present invention can be considered to comprise asystem for utilizing two or more of multiple geometrically differentsemiconductor configurations within a plurality of identical sockets.For instance, the processing of FIGS. 13-22 utilizes a particular nesthaving an interior periphery configured to align the particulargeometrical configuration of the shown semiconductor components. Infurther aspects, the same sockets as those of FIGS. 13-22 can beutilized with a second set of semiconductor components having adifferent geometrical configuration from that of the shown semiconductorcomponents. Such can be accomplished by utilizing different nests havinginterior peripheries configured to align the particular geometricalconfigurations of the second set of semiconductor components. Since thealignment tools are only transitorily associated with the sockets assemiconductor components are placed within the sockets, (as shown abovein FIGS. 17-2 1), the alignment tools can be reused and the sockets arenever substantially modified or specialized until particularsemiconductor components are retained in the sockets.

FIG. 27 shows the socket 74 of FIGS. 13-22 at a processing stageanalogous to that of FIG. 15, but with an exemplary second type ofsemiconductor component 200 having a geometrical configuration muchdifferent than that of the components 82 of FIGS. 13-22, and utilizedwith a second alignment tool 202 for aligning the second componentwithin the socket. Thus, the same socket 74 can be utilized with twodifferent semiconductor component configurations by utilizing differentalignment tools specialized for the semiconductor componentconfigurations, and without modification of the socket. Although themechanical alignment tool is shown modified, it is to be understood thatan optical alignment tool can be modified additionally and/oralternatively to a mechanical alignment tool to adapt for utilizingdifferent semiconductor component configurations.

The manipulator utilized for the second component 200 (FIG. 27) can bethe same as that utilized for the first component 82 (FIG. 15), ordifferent. Similarly, if an optical alignment tool is utilized, theoptical alignment tool utilized for the second component 200 (FIG. 27)can be the same as that utilized for the first component 82 (FIG. 15),or different.

In compliance with the statute, the invention has been described inlanguage more or less specific as to structural and methodical features.It is to be understood, however, that the invention is not limited tothe specific features shown and described, since the means hereindisclosed comprise preferred forms of putting the invention into effect.The invention is, therefore, claimed in any of its forms ormodifications within the proper scope of the appended claimsappropriately interpreted in accordance with the doctrine ofequivalents.

1-18. (canceled)
 19. A method of providing a semiconductor componentwithin a socket, comprising: providing the socket; said socketcomprising a base, a retention mechanism associated with the base andconfigured to retain the semiconductor component, and a lid on the base;the lid being movable to shift the retention mechanism between aretaining position and a non-retaining position; shifting the retentionmechanism to the non-retaining position; while the retention mechanismIs in the non-retaining position, placing the semiconductor componentwithin the socket with a manipulator; the semiconductor component beingoptically aligned as it is placed within the socket, the opticalalignment comprising utilization of an optical alignment tool; after thesemiconductor component is placed within the socket and aligned,shifting the retention mechanism to the retaining position to retain thesemiconductor component within the socket; and after the retentionmechanism is shifted to the retaining position, releasing thesemiconductor component from the manipulator.
 20. The method of claim 19wherein the semiconductor component is a first semiconductor component,and the retention mechanism is a first retention mechanism; wherein thesocket comprises a second retention mechanism which can be shiftedbetween a retaining position and a non-retaining position; and furthercomprising: shifting the second retention mechanism to the non-retainingposition; while the second retention mechanism is In the non-retainingposition, placing a second semiconductor component within the socket;and after the second semiconductor component is within the socket,shifting the second retention mechanism to the retaining position. 21.The method of claim 20 wherein the second semiconductor component isoptically aligned within the socket as it is placed within the socket.22. The method of claim 20 further comprising using the manipulator toplace the second semiconductor component within the socket.
 23. Themethod of claim 22 wherein the second semiconductor component is notreleased from the manipulator until after the second retention mechanismis shifted to the retaining position.
 24. The method of claim 20 whereinthe manipulator is a first manipulator, and further comprising using asecond manipulator to place the second semiconductor component withinthe socket.
 25. The method of claim 19 wherein the semiconductorcomponent comprises a plurality of terminal contacts arranged In a ballgrid array; and wherein the retention mechanism includes clampsconfigured to grasp individual balls of the ball grid array.
 26. Themethod of claim 19 wherein the semiconductor component comprises aplurality of terminal contacts arranged in a ball grid array; andwherein the retention mechanism Includes one or more clamps configuredto compress the component against the base of the socket.
 27. The methodof claim 19 wherein the semiconductor component comprises a plurality ofterminal contacts arranged in a land grid array; and wherein theretention mechanism includes one or more clamps configured to compressthe component against the base of the socket. 28-34. (canceled)